Bharat Book introduces a report "Thermal Interface Materials: Technologies, Applications and Global Markets" In recent years, tremendous progress, both technologically and in terms of demand, has been made in electronic devices and systems. The technological progress has come on two main fronts: increased functionality on a single-device unit and miniaturization of each unit. Both of these developments have increased the need for thermal management technologies, including thermal interface materials (TIM).
In the thermal management of microelectronics, the interface material layer between a chip and heat spreader presents the single largest barrier to heat flow in the packaging of high-power dissipation devices. http://www.bharatbook.com/market-research-reports/information-technology-market-research-report/thermal-interface-materials-technologies-applications-and-global-markets.html
The selection of a suitable material to fill the interface between a chip and a heat spreader is critical to the performance and reliability of the semiconductor device. For this reason, continuous effort has been made to develop new thermal interface technologies.
BCC Research has published a report on the market for all types of thermal management technologies (SMC024G The Market for Thermal Management Technologies, now in its seventh edition). BCC Research, however, believes that the importance of TIM materials and the high rate of innovation merit more detailed analysis in a report of their own.
STUDY GOALS AND OBJECTIVES
The goal of this report is to provide an up-to-date analysis of recent developments and current trends in the global TIM materials market. Specific objectives include:
Identifying TIM technologies and products with the greatest commercial potential in the near to mid-term (2010–2016).
Analyzing the key drivers and constraints that will shape the market for TIM technologies over the next five years.
Estimating the current and future demand for TIM technologies and products.
Ascertaining which companies are best positioned to meet this demand because of their proprietary technologies, strategic alliances or other advantages.
This report is intended especially for suppliers of TIM and others with a need to understand the status and dynamics of the market for these products. The report is organized around specific technologies, but it is largely nontechnical in nature and coverage, meaning it is concerned less with theory and jargon than with identifying technologies that work, projecting the amount of the latter the market is likely to purchase and estimating the price that is likely to be paid.
As such, the report’s main audience is executive management, business development, marketing departments and financial analysts. It is not written specifically for scientists and technologists, although its findings measure and analyze the market for their work, including the availability of government and corporate research funding for different technologies and applications.
SCOPE AND FORMAT
The report addresses the global market for thermal interface materials products during the period from 2011 through 2017, including:
Adhesive films and tapes.
The report format includes these major elements:
TIM technologies and products.
Applications and end users.
Developers and suppliers.
Market estimates and projections.
Industry structure and competition.
The geographic scope for this report is the global market.
INFORMATION SOURCES AND METHODOLOGY
The findings and conclusions of this report are based on information gathered using both primary and secondary research methodologies from various sources. The primary sources of information were Internet searches and industry association data, along with interviews conducted with thermal interface material suppliers, custom engineering companies and manufacturers of representative applications. Secondary sources included industry journals and publications, product literature, white papers and technical journals, and financial reports for industry suppliers.
The base year for analysis and projection is 2011. At the time this report was prepared (February 2013), 2012 data were not yet available for all sectors. Therefore, with 2011 as a baseline, market projections were developed for the period from 2012 to 2017. These projections are based on a combination of a consensus among the primary contacts combined with BCC’s understanding of the key market drivers and their impact from a historical and analytical perspective. The analytical methodologies used to generate the market estimates are described in detail in the market analysis.
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Thermal Interface Materials: Technologies, Applications and