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MEMS Pressure Sensor STMicroelectronics LPS331AP

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61 views announces a new report on "MEMS Pressure Sensor - STMicroelectronics LPS331AP"  a barometric sensor made from a very tiny MEMS die using VENSENS Process that targets altitude and weather forecast applications in mobile devices.

Spet.3, 2013 :  This MEMS sensor positions ST for the upcoming double digit growth pressure sensor market.

Barometric pressure sensors are equipping more and more portable devices. These components sense the pressure of the atmosphere and help consumer products detect altitude variations indoor or improve the accuracy of altitude measurement in complement of GPS. They can also be used to refine local weather forecasting when used as a barometer.

ST’s LPS331AP pressure-sensing device is manufactured using a proprietary MEMS technology, called “VENSENS”, that allows the pressure sensor to be fabricated on a monolithic silicon chip. This process eliminates wafer-to-wafer bonding. The sensing element in the LPS331AP is based on a flexible silicon membrane formed above an air cavity with a controlled gap and defined internal pressure. The membrane is very small compared to traditional silicon micro-machined membranes. The sensor and ASIC are packaged in a 3x3x1mm HCLGA.

This report provides a complete teardown of the MEMS gyro with:

Detailed photos
Material analysis
Schematic assembly description
Manufacturing Process Flow
In-depth manufacturing cost analysis
Supply chain evaluation
Selling price estimation


STMicroelectronics Company Profile

Physical Analysis

Physical Analysis Methodology
Package Characteristics & Markings
Package Opening
Package Composition
Package Cross-Section
ASIC Dimensions & Markings
ASIC Process and metal layers
ASIC Cross-Section
ASIC Process Characteristics
Pressure Sensor Markings
Pressure Sensor Details
Pressure Sensor Dimensions
Pressure Sensor Structure
Pressure Sensor Cross-Section
Pressure Sensor process characteristics

Manufacturing Process Flow

ASIC Process Flow
Pressure Sensor Process Flow
Package Process Flow
Description of the Wafer Fabrication Units

Cost Analysis

Main Steps of Economic Analysis
Supply Chain Analysis
ASIC Wafer Cost
ASIC Probe & Dicing cost
ASIC Die Cost
Pressure Sensor Wafer Cost
Pressure Sensor Wafer : Equipment Cost per Family
Pressure Sensor Wafer : Material Cost per Family
Pressure Sensor Probe & Dicing Cost
Pressure Sensor Die cost
LPS331AP Packaging Process Flow
LPS331AP Packaging Cost Details
LPS331AP Final Test Cost
LPS331AP Component Manufacturing Cost
Yield Synthesis
LPS331AP Cost Analysis Evolution

Estimated Price Analysis

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